产品描述
The Qualcomm SMB-1350-0-49CWLNSP-HR-01-0-00 is engineered to meet the demands of modern wireless communication and IoT applications. Its architecture is optimized for high-speed connectivity, making it ideal for devices that require reliable and fast data transfer, such as smart home devices, wearables, and industrial IoT solutions.
The integration of Wi-Fi 6 and Bluetooth 5.2 ensures that devices powered by this SoC can take advantage of the latest wireless technologies, providing users with enhanced connectivity and performance. The low power consumption design is particularly beneficial for battery-operated devices, allowing for longer usage times without frequent recharging.
Security is a key consideration in the design of the SMB-1350-0, with built-in features that protect data and ensure secure communication. This is crucial for IoT applications, where data integrity and user privacy are paramount.
Overall, the Qualcomm SMB-1350-0-49CWLNSP-HR-01-0-00 is a versatile and efficient SoC that caters to the needs of modern wireless communication and IoT applications, making it a preferred choice for manufacturers looking to deliver cutting-edge technology in compact and energy-efficient packages.
规格参数
CPU Configuration: The SoC typically features a multi-core CPU architecture, which may include a combination of high-performance and low-power cores. This allows for efficient processing of tasks while maintaining energy efficiency.
Wireless Connectivity: The SMB-1350-0 supports Wi-Fi 6 (802.11ax) and Bluetooth 5.2, providing enhanced data rates, increased capacity, and improved performance in dense environments. This makes it suitable for smart home devices, wearables, and other IoT applications.
Memory Support: The SoC is designed to support various types of memory, including LPDDR4X, which offers higher bandwidth and lower power consumption compared to previous generations. This enhances overall system performance and responsiveness.
Operating Temperature Range: The SMB-1350-0 is designed to operate in a wide temperature range, making it suitable for various environments, including industrial and outdoor applications.
Form Factor: The SoC is available in a compact package, making it easy to integrate into small form factor devices, which is essential for modern IoT applications.
