充电芯片

SMB-1354-0-36BWLNSP-HR-01-0-0

  • Improved Signal Integrity: This component is designed with features that enhance signal integrity, such as advanced filtering and noise reduction. These features ensure that signals remain clear and accurate, reducing the risk of data corruption and improving overall system performance.
  • Robust Mechanical Design: The SMB-1354-0-36BWLNSP-HR-01-0-0 is built with a robust mechanical structure that ensures durability and reliability. It is designed to withstand physical stresses and environmental factors, making it suitable for use in rugged or demanding conditions.

产品描述

The Qualcomm SMB-1354-0-36BWLNSP-HR-01-0-0 is a sophisticated electronic component designed to meet the needs of high-bandwidth and high-performance applications. Its ability to support high bandwidth ensures that it can handle large data streams efficiently, making it suitable for applications such as advanced communication systems, high-speed data networks, and complex signal processing tasks.


The component is housed in a 36-pin BWLNSP package, which combines a ball grid array format with low noise shielding. This packaging provides robust mechanical support, enhancing durability and reliability. The low noise shielding helps to maintain signal integrity by reducing interference and ensuring clean signal transmission.


The SMB-1354-0-36BWLNSP-HR-01-0-0 also features advanced signal integrity improvements, including enhanced filtering and noise reduction technologies. These features are essential for maintaining high-quality data transmission and minimizing the risk of signal degradation or data loss.


With its efficient power consumption design, the component helps to extend the operational life of battery-powered systems and reduces the overall energy footprint of electronic devices. Its mechanical robustness and environmental durability make it a reliable choice for use in challenging conditions, ensuring stable performance across a range of applications.


In summary, the Qualcomm SMB-1354-0-36BWLNSP-HR-01-0-0 stands out for its high bandwidth support, improved signal integrity, and robust mechanical design, making it a valuable component for high-performance and demanding electronic systems.


规格参数

  • Package Type: The component comes in a 36-pin BWLNSP (Ball Grid Array with Low Noise Shielding Package). This packaging provides excellent mechanical support and thermal management, which are critical for maintaining performance and reliability.

  • Operating Frequency: The SMB-1354-0-36BWLNSP-HR-01-0-0 operates across a specific frequency range tailored for high-performance communication. It is designed to handle both high and variable frequencies, ensuring versatility in various applications.

  • Power Consumption: This component is designed with efficient power consumption in mind, optimizing energy usage without compromising performance. It supports low power operation, which is beneficial for battery-operated devices and systems with stringent power requirements.


外观图

相关产品