产品描述
The Qualcomm SMB-1355-0-36BWLNSP-SR-00-0-00 is a high-performance electronic component engineered to excel in signal fidelity and electromagnetic compatibility. Its superior signal fidelity ensures that signals are transmitted with minimal distortion and high clarity, which is crucial for applications requiring precise data transmission and reception.
The component is housed in a 36-pin BWLNSP package, offering a compact and efficient design that integrates well into modern electronic systems. The ball grid array format facilitates excellent thermal management, while the low noise shielding helps mitigate interference, ensuring consistent signal quality.
Designed with scalable integration in mind, the SMB-1355-0-36BWLNSP-SR-00-0-00 can be adapted to various system architectures. This scalability makes it a versatile choice for a wide range of applications, from compact consumer electronics to more extensive industrial systems.
Enhanced electromagnetic compatibility features protect the component from external interference, making it suitable for use in environments with high levels of electromagnetic noise. Its thermal characteristics ensure reliable operation even under high thermal stress, contributing to its overall durability and performance.
In summary, the Qualcomm SMB-1355-0-36BWLNSP-SR-00-0-00 offers superior signal fidelity, scalable integration, and enhanced EMC, making it a robust and versatile component for high-performance and demanding electronic applications.
规格参数
Package Type: The component is housed in a 36-pin BWLNSP (Ball Grid Array with Low Noise Shielding Package). This packaging choice provides a small footprint while offering effective thermal management and reduced electromagnetic interference, critical for maintaining performance in dense electronic assemblies.
Operating Frequency Range: The SMB-1355-0-36BWLNSP-SR-00-0-00 operates within a specific frequency range optimized for high-performance applications. This range is designed to support both high-speed and high-frequency operations, ensuring versatility in various communication protocols.
Thermal Characteristics: The component is designed to handle specific thermal conditions. It includes features for efficient heat dissipation, which helps maintain stable performance and prevent overheating during intensive operations.
