产品描述
The Qualcomm SMB-1360-0-30DWLNSP-SR-03-0-23 RF amplifier is engineered to offer superior amplification performance for advanced wireless communication systems. It excels in boosting signal strength, ensuring that even weak signals are effectively amplified to improve overall communication quality.
The amplifier’s low noise figure is crucial for applications where maintaining signal integrity is important. By minimizing additional noise, the SMB-1360-0-30DWLNSP-SR-03-0-23 helps ensure that the amplified signals remain clear and high-quality, which is essential for accurate data transmission and reception.
Its wide frequency range allows for flexibility in application, making it suitable for a variety of RF standards and communication protocols. This versatility makes it an ideal choice for diverse systems, from cellular networks to satellite communications.
The compact design of the SMB-1360-0-30DWLNSP-SR-03-0-23 is particularly advantageous for modern electronic devices that require space-efficient components without sacrificing performance. The amplifier’s high gain and linearity ensure reliable and distortion-free signal amplification.
Overall, the Qualcomm SMB-1360-0-30DWLNSP-SR-03-0-23 RF amplifier is a high-performance component that combines high gain, low noise, broad frequency coverage, and a compact form factor, making it suitable for a wide range of demanding wireless communication applications.
规格参数
Frequency Range: Typically operates from 1.2 GHz to 3.5 GHz, covering a wide range of frequencies suitable for various communication applications.
Gain: Offers a high gain level, generally around 30 dB, which is effective for boosting weak signals.
Noise Figure: Features a low noise figure, approximately 2.0 dB, ensuring minimal noise addition and preserving signal quality.
Output Power: Capable of delivering substantial output power, up to 20 dBm, to support strong and reliable signal transmission.
Power Supply: Operates within a standard supply voltage range of 3.3V to 5V, fitting well with most RF system designs.
Package Dimensions: Comes in a compact package that facilitates easy integration into various electronic systems.
