充电芯片

SMB-1390-0-42CWLNSP-TR-03-0-01

  • High Integration: The SMB-1390 is designed with a high level of integration, combining multiple functionalities into a single chip, which reduces the need for additional components and simplifies the design process for manufacturers.
  • Advanced Connectivity: This module supports a variety of connectivity options, including Wi-Fi, Bluetooth, and other wireless communication protocols, enabling versatile applications in IoT and smart devices.
  • Low Power Consumption: The SMB-1390 is optimized for energy efficiency, making it suitable for battery-powered devices and applications where power conservation is critical.

产品描述

The Qualcomm SMB-1390-0-42CWLNSP-TR-03-0-01 is a highly integrated wireless communication module that exemplifies Qualcomm's commitment to innovation in the field of connectivity solutions. This module is specifically engineered to meet the growing demands of modern applications, particularly in the Internet of Things (IoT) and smart device markets.


With its advanced connectivity capabilities, the SMB-1390 supports a wide range of wireless protocols, including Wi-Fi and Bluetooth, allowing devices to communicate seamlessly across different networks. This versatility makes it an ideal choice for applications such as smart home devices, wearables, and industrial automation systems.


The module's low power consumption is a significant advantage, enabling manufacturers to create energy-efficient products that can operate for extended periods on battery power. This is particularly important in applications where frequent recharging is impractical.


In terms of performance, the SMB-1390 delivers robust data throughput and connection stability, ensuring that devices maintain reliable communication even in challenging environments. Its enhanced security features protect sensitive data during transmission, making it suitable for applications that require high levels of data integrity and user privacy.


In summary, the Qualcomm SMB-1390-0-42CWLNSP-TR-03-0-01 is a powerful, efficient, and secure wireless communication module that is well-suited for a wide range of modern technological applications, driving innovation in connectivity solutions for IoT and smart devices.


规格参数

  • Chipset Architecture: The SMB-1390 is built on a modern architecture that supports high-speed processing and efficient data handling.

  • Operating Frequency: It operates across multiple frequency bands, ensuring compatibility with various wireless standards and enhancing connectivity options.

  • Memory Support: The module supports various memory configurations, allowing for efficient data storage and retrieval.

  • Form Factor: The SMB-1390 is designed in a compact form factor, facilitating easy integration into a wide range of devices, from consumer electronics to industrial applications.

  • Environmental Tolerance: It is designed to operate reliably under a range of environmental conditions, making it suitable for both indoor and outdoor applications.


外观图

相关产品