产品描述
The Qualcomm SMB-1396-0-WLPSP100-TR-02-0-01 is a sophisticated power amplifier designed to meet the demands of modern communication systems. Its high-efficiency design ensures that it can deliver robust performance while minimizing power consumption, making it an ideal choice for battery-powered and energy-efficient devices.
With its wide frequency range, the amplifier can be employed in a variety of applications, from consumer electronics to industrial and military communication systems. Its high output power capability ensures that signals are transmitted with sufficient strength to cover larger areas or penetrate through obstacles, enhancing the reliability of the communication link.
The compact and lightweight design of the SMB-1396-0-WLPSP100-TR-02-0-01 allows it to be used in applications where space is at a premium. Its robust construction ensures that it can withstand the rigors of operation in diverse environments, providing reliable performance over an extended period.
Overall, the Qualcomm SMB-1396-0-WLPSP100-TR-02-0-01 is a versatile and high-performance power amplifier that meets the needs of various high-frequency communication applications. Its combination of efficiency, power, and durability makes it a valuable component in advanced electronic systems.
规格参数
Frequency Range: The amplifier supports a wide frequency range, typically from 1 GHz to 6 GHz, allowing it to be used in various communication bands, including Wi-Fi, cellular, and satellite applications.
Output Power: It is designed to deliver high output power, which is crucial for ensuring strong signal transmission and coverage in wireless communication systems.
Gain: The amplifier provides significant gain, contributing to the amplification of weak signals and improving overall system performance.
Supply Voltage: It operates at a specified supply voltage, which is crucial for maintaining the stability and efficiency of the amplifier.
Package Type: The SMB-1396-0-WLPSP100-TR-02-0-01 comes in a specific package type, such as a surface-mount or through-hole package, which facilitates its integration into various electronic assemblies.
