音频编解码器

WCD-9326-0-113FOWPSP-HR-03-0

  • The Qualcomm WCD-9326-0-113FOWPSP-HR-03-0 is a highly integrated audio codec and smart power management IC designed for mid-range and high-end mobile and consumer electronics applications.
  • It provides advanced audio processing capabilities, including support for high-resolution audio, noise cancellation, and voice enhancement.

产品描述

The Qualcomm WCD-9326-0-113FOWPSP-HR-03-0 is a highly integrated audio codec and power management IC designed for mid-range and high-end mobile and consumer electronics applications. It provides advanced audio processing capabilities, including support for high-resolution audio up to 24-bit/192kHz, as well as noise cancellation and voice enhancement features.


The device features a power-efficient design, with advanced power management functions to optimize battery life in portable devices. It integrates a range of power management functions, including power supply regulation, battery charging, and power sequencing, simplifying the overall system design.


The WCD-9326-0-113FOWPSP-HR-03-0 is available in a compact, space-saving 113-pin FOWPSP package, making it suitable for space-constrained applications. This integrated solution helps reduce the overall component count and board space required, enabling more compact and efficient product designs.


Overall, the Qualcomm WCD-9326-0-113FOWPSP-HR-03-0 is a highly versatile and feature-rich audio codec and power management IC that can be leveraged in mid-range and high-end mobile and consumer electronics applications, providing advanced audio capabilities and efficient power management in a compact package.


规格参数

  • Audio Codec Features:

    • Support for high-resolution audio up to 24-bit/192kHz

    • Advanced audio processing capabilities, including noise cancellation and voice enhancement

    • Integrated headphone and speaker amplifiers

    • Support for multiple audio input and output channels

  • Power Management Features:

    • Integrated power supply regulation and battery charging

    • Power sequencing and control for various system components

    • Power-efficient design for extended battery life

  • Package:

    • 113-pin FOWPSP (Fan-Out Wafer Level Chip Scale Package)

    • Compact and space-saving design


外观图

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