音频编解码器

WCD-9326-0-113FOWPSP-TR-03-0

  • Advanced audio processing capabilities with support for various audio codecs and formats
  • Integrated digital-to-analog converters (DACs) and analog-to-digital converters (ADCs) for seamless audio input and output

产品描述

The Qualcomm WCD-9326-0-113FOWPSP-TR-03-0 is a highly versatile audio codec that is designed to meet the demanding requirements of modern mobile and consumer electronics devices. It features a comprehensive set of audio processing capabilities, including support for a wide range of audio codecs and formats, as well as advanced audio post-processing algorithms for noise cancellation, echo cancellation, and audio enhancement.


The integrated DACs and ADCs provide seamless audio input and output, allowing for high-quality audio playback and recording. The device's low-power design ensures efficient power consumption, making it well-suited for battery-powered mobile devices.


The extensive connectivity options, including I2S, PCM, and PDM interfaces, enable flexible system integration, allowing the WCD-9326-0-113FOWPSP-TR-03-0 to be easily integrated into a wide range of audio applications. The configurable GPIO pins further enhance the device's versatility, allowing for customized system configurations.


The robust power management features of the WCD-9326-0-113FOWPSP-TR-03-0 ensure efficient power consumption, contributing to extended battery life in mobile devices. The device's wide operating temperature range of -40°C to +105°C also makes it suitable for a variety of environmental conditions.


Overall, the Qualcomm WCD-9326-0-113FOWPSP-TR-03-0 is a highly capable and versatile audio codec that offers a comprehensive set of features and specifications, making it an ideal choice for a wide range of mobile and consumer electronics applications.


规格参数

  • Audio Codec: 24-bit, 192 kHz sampling rate

  • Analog Inputs: 4 channels

  • Analog Outputs: 4 channels

  • Digital Interfaces: I2S, PCM, PDM

  • Power Supply: 1.8 V and 3.3 V

  • Operating Temperature Range: -40°C to +105°C

  • Package: 113-pin FOWLP (Flip-Chip On Wafer Level Package)

  • Dimensions: 5.5 mm x 5.5 mm x 0.6 mm


外观图

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