产品描述
The Qualcomm QCN-9074-1-MSP234-TR-01-0 is a next-generation wireless chipset tailored for the evolving demands of connectivity in smart devices and IoT applications. Its dual-band functionality allows devices to leverage both 2.4 GHz and 5 GHz frequencies, optimizing performance based on the specific network environment. This flexibility helps mitigate interference, ensuring stable connections even in crowded networks.
With Wi-Fi 6 compliance, the QCN-9074 brings significant improvements over previous Wi-Fi standards. Technologies like OFDMA enable multiple users to share the same channel without interference, enhancing overall network efficiency. This capability is particularly beneficial in high-density environments, such as office buildings or smart homes filled with connected devices, where many users compete for bandwidth.
The addition of Bluetooth 5.1 further extends the versatility of the QCN-9074. This standard offers faster data transfer rates and greater range compared to its predecessors, facilitating seamless communication between devices. Whether it’s connecting a smartphone to wireless earbuds or syncing a smart home hub with various sensors, the QCN-9074 provides robust support for a wide array of applications.
Energy efficiency is a hallmark of the QCN-9074’s design. By incorporating advanced power management features, the chipset can effectively minimize energy consumption, which is critical for IoT devices that often operate on battery power. This energy efficiency allows for longer operational lifetimes, reducing the need for frequent recharging and maintenance.
Security is paramount in today’s digital landscape, and the QCN-9074 addresses this with a suite of advanced security protocols. It supports WPA3, the latest Wi-Fi security standard, ensuring that user data remains encrypted and secure during transmission. This level of security is essential for protecting sensitive information in connected environments, such as smart homes and industrial applications.
In summary, the Qualcomm QCN-9074-1-MSP234-TR-01-0 is a highly advanced wireless chipset that caters to the growing needs of connectivity in modern applications. With its dual-band capabilities, Wi-Fi 6 compliance, Bluetooth 5.1 support, and robust security features, it provides a comprehensive solution for developers looking to create innovative and reliable connected devices in the ever-expanding IoT landscape.
规格参数
Wireless Standards:
Wi-Fi: 802.11ax (Wi-Fi 6)
Bluetooth: 5.1
Frequency Bands:
2.4 GHz: Supports data rates of up to 150 Mbps
5 GHz: Supports data rates of up to 1.2 Gbps
Data Throughput:
Maximum Wi-Fi Data Rate: Up to 1.2 Gbps for efficient data handling.
Bluetooth Data Rate: Up to 2 Mbps for quick device communication.
Antenna Configuration:
2x2 MIMO (Multiple Input Multiple Output) support enhances range and throughput by utilizing multiple antennas for signal transmission.
Power Specifications:
Operating Voltage: 3.3V
Power Consumption: Approximately 100 mW in low-power modes, ideal for energy-sensitive applications.
Interface Support:
Serial Peripheral Interface (SPI) for peripheral connectivity.
Universal Asynchronous Receiver-Transmitter (UART) for serial communication.
SDIO (Secure Digital Input Output) for additional connectivity options.
Operating Environment:
Temperature Range: -40°C to 85°C, ensuring reliability in various operating conditions, including industrial and outdoor settings.