功率放大器

QPA-8685-0-47BLGA-TR-01-0

  • Low Noise Figure: The amplifier features a low noise figure, which minimizes the amount of noise added to the signal. This characteristic ensures high-quality signal amplification with minimal degradation, preserving the integrity of the transmitted data.
  • Compact Package: Housed in a 47-pin BLGA (Ball Grid Array) package, the QPA-8685-0-47BLGA-TR-01-0 is designed to be space-efficient. This compact form factor is ideal for integration into densely packed electronic systems, making it suitable for modern mobile devices and communication infrastructure.

产品描述

The Qualcomm QPA-8685-0-47BLGA-TR-01-0 is an advanced RF power amplifier that delivers high performance and versatility for modern communication systems. Here’s a detailed look into its design, functionality, and applications:

Design and Materials: The amplifier is constructed using high-quality semiconductor materials and advanced manufacturing techniques. These design choices ensure that the QPA-8685-0-47BLGA-TR-01-0 can handle high frequencies and power levels with efficiency and reliability. The use of high-grade materials contributes to its low noise figure and high linearity.

Operational Characteristics: The amplifier’s wide frequency range makes it suitable for a variety of wireless communication applications. It is particularly effective in systems that operate within the 2.5 GHz to 3.5 GHz range, including LTE and 5G networks. The high gain and output power provided by the QPA-8685-0-47BLGA-TR-01-0 enable it to amplify weak signals effectively, ensuring strong and clear communication.

Thermal Management: Effective thermal management is a key feature of this amplifier. The low thermal resistance ensures that heat generated during operation is efficiently dissipated, preventing overheating and potential performance degradation. This capability is crucial for maintaining consistent performance in demanding environments.

Integration and Packaging: The 47-pin BLGA package design offers a compact and efficient solution for integrating the amplifier into electronic systems. The BLGA package not only supports reliable electrical connections but also allows for a smaller footprint on the PCB, making it suitable for compact and portable devices.

Applications: The QPA-8685-0-47BLGA-TR-01-0 is ideal for use in a range of applications, including cellular base stations, wireless communication systems, and satellite communication. Its high output power and low noise figure make it suitable for scenarios where signal integrity and strength are critical.

Reliability and Durability: The amplifier is engineered to operate reliably under a range of environmental conditions. Its robust design ensures durability and consistent performance, even in challenging scenarios such as high-temperature environments or high-stress conditions.

In summary, the Qualcomm QPA-8685-0-47BLGA-TR-01-0 is a high-performance RF power amplifier that combines advanced features with reliable operation. Its wide frequency range, high gain, and efficient thermal management make it a versatile choice for modern communication systems requiring robust amplification and signal clarity.


规格参数

  • Frequency Range: The amplifier operates over a frequency range of approximately 2.5 GHz to 3.5 GHz. This range encompasses various communication bands used in contemporary wireless systems.

  • Gain: It provides a high gain of around 22 dB. This gain level is essential for amplifying weak input signals to a stronger output level, enhancing the overall performance of the communication system.

  • Output Power: The QPA-8685-0-47BLGA-TR-01-0 can deliver up to 33 dBm (2 watts) of output power. This high power output is suitable for applications requiring significant signal strength and coverage.

  • Noise Figure: The amplifier features a low noise figure of approximately 1.8 dB. A low noise figure is crucial for ensuring that the amplifier introduces minimal additional noise to the signal.

  • Power Supply Voltage: The device operates with a power supply voltage ranging from 5V to 15V. This flexible voltage range allows for compatibility with various power management schemes.

  • Thermal Resistance: The amplifier is designed with a thermal resistance of about 20°C/W. This specification indicates its efficient heat dissipation capabilities, which is vital for maintaining optimal performance.

  • Package Type: It comes in a 47-pin BLGA (Ball Grid Array) package. The BLGA packaging provides a reliable and compact solution for mounting on printed circuit boards (PCBs), ensuring robust electrical performance and ease of integration.


外观图

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