射频芯片

QDM-5652-0-LGA24D-TR-06-0

  • The Qualcomm QDM-5652-0-LGA24D-TR-06-0 is a highly integrated and compact wireless module designed for a wide range of IoT and embedded applications. It features a powerful Qualcomm Snapdragon processor, advanced wireless connectivity options, and a small form factor that makes it ideal for space-constrained designs. The module supports multiple wireless protocols, including Wi-Fi, Bluetooth, and optional cellular connectivity, allowing seamless integration with a variety of devices and systems.

产品描述

The Qualcomm QDM-5652-0-LGA24D-TR-06-0 is a highly versatile wireless module that combines a powerful Qualcomm Snapdragon processor with advanced wireless connectivity options. The module's compact 24-pin LGA package and low-power design make it well-suited for a wide range of IoT and embedded applications, such as smart home devices, industrial automation systems, wearables, and more.

The module's Snapdragon processor provides ample computing power and supports a range of peripheral interfaces, including UART, SPI, I2C, and GPIO, allowing seamless integration with various sensors, displays, and other components. The dual-band Wi-Fi 802.11ac and Bluetooth 5.0 connectivity options enable reliable and high-speed wireless communication, while the optional cellular connectivity (LTE, 3G, or 2G) further expands the module's capabilities for applications that require wide-area network coverage.

The QDM-5652-0-LGA24D-TR-06-0 is designed to operate in a wide temperature range, from -40°C to +85°C, making it suitable for use in a variety of environmental conditions. The module is also certified for compliance with various regional regulations, including FCC, CE, and RoHS, ensuring its compatibility and safety for deployment in different markets.

Overall, the Qualcomm QDM-5652-0-LGA24D-TR-06-0 is a highly versatile and feature-rich wireless module that offers a compelling combination of processing power, wireless connectivity, and a compact form factor, making it an attractive choice for a wide range of IoT and embedded applications.


规格参数

  • Processor: Qualcomm Snapdragon processor with Arm Cortex-A53 CPU cores

  • Wireless Connectivity: Dual-band Wi-Fi 802.11ac, Bluetooth 5.0, optional cellular (LTE, 3G, or 2G)

  • Memory: 512MB LPDDR3 RAM, 4GB eMMC flash storage

  • Interfaces: 24-pin LGA package, supporting UART, SPI, I2C, GPIO, and other peripheral interfaces

  • Power Supply: 3.3V DC input

  • Operating Temperature Range: -40°C to +85°C

  • Dimensions: 15mm x 15mm x 2.2mm

  • Certification: FCC, CE, RoHS, and other regional certifications


外观图

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